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 2SK2094
Transistors
4V Drive Nch MOS FET
2SK2094
Structure Silicon N-channel MOS FET External dimensions (Unit : mm)
CPT3
6.5 5.1
2.3 0.5
Features 1) Low On-resistance. 2) Fast switching speed. 3) Wide SOA (safe operating area). 4) 4V drive. 5) Drive circuits can be simple. 6) Parallel use is easy.
5.5
1.5
0.9
0.75 0.65
(1)Gate (2)Drain (3)Source
0.9
(1)
2.3
(2) (3)
2.3
0.8Min.
0.5 1.0
Abbreviated symbol : K2094
Applications Switching
Packaging specifications
Package Type Code Basic ordering unit (pieces) 2SK2094 Taping TL 2500
Inner circuit
(1) Gate (2) Drain (3) Source
(1)
(2)
(3)
Absolute maximum ratings (Ta=25C)
Parameter Drain-source voltage Gate-source voltage Continuous Drain current Reverse drain current Pulsed Continuous Pulsed Symbol VDSS VGSS ID IDP IDR IDRP PD Tch Tstg Limits 60 Unit V V A A A A W
20
2 8 2 8 10 150 -55 to +150
Total power dissipation(Tc=25C) Channel temperature Storage temperature
C C
Pw 300s, Duty cycle 2%
Rev.A
2.5
1.5
9.5
1/4
2SK2094
Transistors
Electrical characteristics (Ta=25C)
Parameter Gate-source leakage Drain-source breakdown voltage Zero gate voltage drain current Gate threshold voltage Static drain-source on-state resistance Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Reverse recovery time (Body Diode) Symbol IGSS V(BR)DSS IDSS VGS(th) RDS(on) Yfs Ciss Coss Crss td(on) tr td(off) tf trr Min. - 60 - 1.0 - - 1.0 - - - - - - - - Typ. - - - - 0.3 0.4 - 400 150 50 10 20 100 40 100 Max. Unit nA V A V S pF pF pF ns ns ns ns ns Test Conditions VGS= 20V, VDS=0V ID=1mA, VGS=0V VDS=60V, VGS=0V VDS=10V, ID=1mA ID=1A, VGS=10V ID=1A, VGS=4V VDS=10V, ID=1A VDS=10V VGS=0V f=1MHz ID=1A, VDD=30V VGS=10V RL=30 RG=10 IDR=2A, VGS=0V, di/dt=50A/s
100
- 100 2.5 0.35 0.5 - - - - - - - - -
Rev.A
2/4
2SK2094
Transistors
Electrical characteristics curve
10 5
DRAIN CURRENT : ID (A)
4
Op is era lim tio ite n i d nt by hi RD s a r S( on ea )
P
D
W=
DRAIN CURRENT : ID (A)
DRAIN CURRENT : ID (A)
2 1 0.5 0.2 0.1 0.05
10
m
s
3
10V 8V 6V 4V
Ta=25C Pulsed
5 2 1 0.5 0.2 0.1 0.05 0.02 0.01
Ta=125C 75C 25C -25C
VDS=10V Pulsed
s 1m
C
O
pe ra
tio n
VGS=3V 2
1
0.02 Tc=25C Single pulse 0.01 0.1 0.2 0.5 1
2
5
10 20
50 100
0 0
1
2
3
4
5
0.005 0
1
2
3
4
5
6
7
8
DRAIN-SOURCE VOLTAGE : VDS (V)
DRAIN-SOURCE VOLTAGE : VDS (V)
GATE-SOURCE VOLTAGE : VGS (V)
Fig.1 Maximum Safe Operating Area
Fig.2 Typical Output Characteristics
Fig.3 Typical Transfer Characteristics
GATE THRESHOLD VOLTAGE : VGS(th) (V)
4
STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(on) ()
5 2 1 0.5 0.2 0.1 0.05 0.02 0.01 0.005 0.01 0.02 0.05 0.1 0.2 0.5
Ta=125C 75C 25C -25C
STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(on) ()
VDS=10V lD=1mA
10
VGS=10V Pulsed
10 5 2
1 0.5 0.2 0.1 0.05 0.02 0.01 0.005 0.01 0.02 0.05 0.1 0.2
Ta=125C 75C 25C -25C
VGS=4V Pulsed
3
2
1
0 -50 -25
0
25
50
75
100 125 150
1
2
5
0.5
1
2
5
CHANNEL TEMPERATURE : Tch (C)
DRAIN CURRENT : I D (A)
DRAIN CURRENT : I D (A)
Fig.4 Gate Threshold Voltage Fig.4 vs. Channel Temperature
Fig.5 Static Drain-Source On-State Resistance Fig.6 Static Drain-Source On-State Resistance Fig.6 vs. Drain Current ( ) Fig.5 vs. Drain Current ( )
FORWARD TRANSFER ADMITTANCE : YfS (S)
STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(on) ()
STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(on) ()
0.6 0.5 0.4 0.3 0.2 0.1
0 0 ID=2A 1A
Ta=25C Pulsed
0.8 0.7
VGS=10V ID=1A Pulsed
10
5 2 1
0.5 0.2 0.1
Ta= -25C 25C 75C 125C
VDS=10V Pulsed
0.6 0.5 0.4 0.3
0.2
0.05 0.02 0.01 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1 2 5
0.1 0 -50 -25 0 25 50 75 100 125 150
5
10
15
20
GATE-SOURCE VOLTAGE : VGS (V)
CHANNEL TEMPERATURE : Tch (C)
DRAIN CURRENT : I D (A)
Fig.7 Static Drain-Source On-State Resistance Fig.7 vs. Gate-Source Voltage
Fig.8 Static Drain-Source On-State Resistance Fig.8 vs. Channel Temperature
Fig.9 Forward Transfer Admittance Fig.9 vs. Drain Current
Rev.A
3/4
2SK2094
Transistors
REVERSE DRAIN CURRENT : IDR (A)
2 1 0.5 0.2 0.1 0.05 0.02 0.01 0.005 0 0.5 1
Ta=125C 75C 25C -25C
VGS=0V Pulsed
REVERSE DRAIN CURRENT : IDR (A)
5
5 2 1 0.5 0.2 0.1 0.05 0.02 0.01 0 0.5 1
CAPACITANCE : C (pF)
0V
VG
1 S=
0V
Ta=25C Pulsed
2000 1000 500
Ta=25C f=1MHz VGS=0V Pulsed
Ciss
200 100 50
Coss
Crss
1.5
1.5
20 1
2
5
10
20
50
100
SOURCE-DRAIN VOLTAGE : VSD (V)
SOURCE-DRAIN VOLTAGE : VSD (V)
DRAIN-SOURCE VOLTAGE : VDS (V)
Fig.10 Reverse Drain Current Fig.10 vs. Source-Drain Voltage ( )
Fig.11 Reverse Drain Current Fig.11 vs. Source-Drain Voltage ( )
Fig.12 Typical Capacitance Fig.12 vs. Drain-Source Voltage
500
200
SWITCHING TIME : t (ns)
NORMALIZED TRANSIENT THERMAL RESISTANCE : r ( t )
td(off)
100 50 20 10 5 2 0.02
Ta=25C VDD=30V VGS=10V RG=10 Pulsed
10
1
D=1 0.5 0.2
tf
0.1
tr td(on)
0.1 0.05 0.02
Tc=25C th(ch-c) (t)=r (t) th (ch-c) th(ch-c) =6.25C/W
0.01
0.01 Single pulse
0.001 10 100 1m 10m
PW
T
D=PW T
0.05 0.1
0.2
0.5
1
2
5
100m
1
10
DRAIN CURRENT : ID (A)
PULSE WIDTH : PW (s)
Fig.13
Switching characteristics (See Figure. 15 and 16 for the measurement circuit and resultant waveforms)
Fig.14 Normalized Transient Thermal Resistance vs . Pulse Width
Switching characteristics measurement circuit
Pulse Width 50% 10% 10% 90% 50%
VGS
ID D.U.T. RL
VDS
VGS VDS
RG
10% 90% 90%
td(off) tf toff
VDD
td(on) ton tr
Fig.15 Switching Time Test Circuit
Fig.16 Switching Time Waveforms
Rev.A
4/4
Appendix
Notes
No technical content pages of this document may be reproduced in any form or transmitted by any means without prior permission of ROHM CO.,LTD. The contents described herein are subject to change without notice. The specifications for the product described in this document are for reference only. Upon actual use, therefore, please request that specifications to be separately delivered. Application circuit diagrams and circuit constants contained herein are shown as examples of standard use and operation. Please pay careful attention to the peripheral conditions when designing circuits and deciding upon circuit constants in the set. Any data, including, but not limited to application circuit diagrams information, described herein are intended only as illustrations of such devices and not as the specifications for such devices. ROHM CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any third party's intellectual property rights or other proprietary rights, and further, assumes no liability of whatsoever nature in the event of any such infringement, or arising from or connected with or related to the use of such devices. Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or otherwise dispose of the same, no express or implied right or license to practice or commercially exploit any intellectual property rights or other proprietary rights owned or controlled by ROHM CO., LTD. is granted to any such buyer. Products listed in this document are no antiradiation design.
The products listed in this document are designed to be used with ordinary electronic equipment or devices (such as audio visual equipment, office-automation equipment, communications devices, electrical appliances and electronic toys). Should you intend to use these products with equipment or devices which require an extremely high level of reliability and the malfunction of with would directly endanger human life (such as medical instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers and other safety devices), please be sure to consult with our sales representative in advance. About Export Control Order in Japan Products described herein are the objects of controlled goods in Annex 1 (Item 16) of Export Trade Control Order in Japan. In case of export from Japan, please confirm if it applies to "objective" criteria or an "informed" (by MITI clause) on the basis of "catch all controls for Non-Proliferation of Weapons of Mass Destruction.
Appendix1-Rev1.1


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